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  MPT1000 

OKK


 .Non-contact, providing non-destructive thickness
  measurements .
 .0.1 µm thickness resolution, providing thickness
  uniformity and Q/C control .
 .TTV, Bow & Warp, Bump Wafer, Tape Wafer

 .Download:MPT1000.pdf


  MPS

OKK


 .Fully automated wafer handling system
 .Integrated vibration air isolation system
 .Automated Objective changer
 .Wafer planar and edge measurements


 .Download: MPS.pdf


  MP2100

OKK


 .Non-contact measurement
 .Roughness and waviness from a single scan
 .Semiconductor
 .Optics
 
 .Download: MP2100.pdf


  MP2200

OKK


 .Sub-Angstrom height resolution (0.01nm)
 .Wafer planar and edge measurements
 .Scan lengths from sub micron to 100 mm
 .50 nm Sampling
 .Data Storage


 .Download:MP2200.pdf


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